Tungsten –Copper alloy is the composite of Tungsten and Copper which own the excellent performances
of Tungsten and Copper, such as heat-resistant, ablate-resistant, high-intensity,high-density, excellent
thermal and electrical conductivity. It is easy to be machined. It is used widely in such industries as engine,
electric power, electron, metallurgy, spaceflight and avigation.
Using CIP formation, sintered tungsten skeleton and infiltrating copper (silver) technology, large size and
special shape products of tungsten-copper (silver) composites with 6-90 percent of copper are produced,
such as electric contacts, electrode, refractory parts, heat sinks and parts of rocket. We can also produce
sheet material, tubing, plate and other small products by mould pressing, extrusion pressing and MIM.
1、High performance materials used in spaceflight field
Tungsten –Copper alloy has such excellent performances as heat-resistant, ablate-resistant, high - intensity, high-density and self-cooling,so it is widely used in spaceflight field. Our company has been
researching and producing Tungsten-Copper alloys in spaceflight field for 45 years.
We have ever gained the national second prize of invention and national secrecy patent.
2、Electrical Contact materials
Electrical contacts are subjected to extreme mechanical and thermal stresses during operation. For fractions
of a second, temperatures rise to several thousand degrees as a result of the arcing. Our tungsten-Copper
materials are used owing to their unique physical properties.
Advantages: without other element except Tungsten and Copper, uniform material, low content of gas and
impurity, very high burn-off resistance, excellent thermal and electrical conductivity, all necessary joining
and machining processes.
????? High performance materials used in spaceflight field Electrical Contact materials
3、Electrodes for Spark Erosion
Our WCu electrodes are best suitable for EDM machining of those materials.
Advantages: low wear, high contour sharpness, good machinability.
Types of product: rods, tubes and plates.
4、Electronics Packaging Materials
Refractory Metal& Ceramics Branch has developed a high temperature sinter and infiltrate process for the
manufacture of controlled expansion composite (CEC) materials. Our sinter and infiltrate process allows to offer
tungsten/copper components with the ability to achieve extremely flat surface conditions. We use only high
purity raw materials. There are no lubricants or sintering aides added during processing. The result is a CEC
component with excellent dimensional stability (CTE), thermal uniformity (TC), and flatness applicable to
optoelectronic applications.
Refractory Metal& Ceramics Branch’s Unique Process Offers the Following Advantages:
_ Ability to vary metal matrix density to achieve optimum combination of CTE and TC values
_ Excellent dimensional stability unaffected by high temperature cycling
_ Machinable to exceptional flatness and surface finish
_ Superior thermal conductivity compared to competitive products
_ Metallization capability includes electrolytic and electroless plating and thin film deposition
These characteristics make Refractory Metal& Ceramics Branch `s tungsten composites ideally suited for high
power laser diode applications, silicon and III-V semiconductor materials, DWDM optical platforms and
optoelectronic packages.
Dimentional:
W-Cu heat sinks galvanically plated with Ni or NiAu or electroless Ni plated
Semi-finished products: up to 100x100mm with a thickness of 0.5 to 50mm.
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